Samsung Recruits Across HBM4-to-HBM5 Design, Bonding, and Qualification Simultaneously

Samsung has launched an experienced-hire recruitment drive spanning HBM design, packaging, and customer qualification. With an eye on scaling up HBM4 production and developing next-generation products, the company aims to strengthen coordination across processes to shorten development timelines and improve mass-production yields, boosting its competitiveness in the AI memory market.