China's DF1000 Takes On AI Training at 14nm, Shifting the Competitive Bottleneck to 3D Stacking

Shanghai-based Dongfang Suanxin has unveiled the DF1000, an AI chip that combines a 14nm process with 3D stacking technology against the backdrop of US export controls. Its design vertically stacks logic circuits and DRAM to achieve high memory bandwidth, but mass-production yield and building a practical software ecosystem remain challenges ahead.