Exynos 2400

Exynos 2400 is a high-end mobile System-on-Chip (SoC) developed by Samsung. It features a 10-core CPU architecture including Cortex-X4, A720, and A520 cores. Built on Samsung's 4nm LPP+ process, it integrates the Xclipse 940 GPU based on AMD's RDNA3 architecture. It is notable for introducing Fan-out Wafer Level Packaging (FOWLP) to the Exynos line to improve thermal management and efficiency.