Korean business outlet ChosunBiz reported on October 25, 2026 that Samsung's next-generation smartphone processor, the "Exynos 2700," outperformed Qualcomm's "Snapdragon 8 Elite Extreme Gen 6" by about 20% in CPU performance in internal testing. In the Geekbench 6.5 multi-core test, the Exynos 2700 reportedly scored about 13,000 points versus about 11,000 for the Snapdragon. However, the performance gap ranges from 15% to 44% depending on the comparison target and benchmark version, and GPU results also differ by evaluation item. The figures are based on Samsung's internal testing; they are neither an official performance announcement nor the result of independent third-party verification. How the Exynos 2700 will actually perform in a real smartphone will need to wait for evaluations that include power consumption and cooling conditions in the final product.
CPU gap ranges from 15% to 44%, and GPU results vary by test type
According to ChosunBiz, citing industry sources, the Exynos 2700's CPU performance showed an advantage of 15% to 44% depending on which Snapdragon model and which benchmark version it was compared against. GPU performance was also reported to differ by roughly 5% to 20% depending on the type of workload evaluated. These figures were obtained under different conditions and do not indicate an overall performance improvement for the smartphone as a whole.
The main reported comparisons are summarized below.
| Item | Benchmark / test | Compared against | Exynos 2700 advantage | Reported score |
|---|---|---|---|---|
| CPU multi-core | Geekbench 6.5 | Extreme model | About 20% | About 13,000 vs. about 11,000 |
| CPU multi-core | Geekbench 7.0 | Extreme model | About 15% | Not reported |
| CPU multi-core | Geekbench 6.5 | Standard model | 44% | Not reported |
| CPU multi-core | Geekbench 7.0 | Standard model | 36% | Not reported |
| GPU | Maximum processing performance in demanding games using the latest technology | Extreme model | About 20% | Not reported |
| GPU | Basic graphics computation performance in typical demanding 3D games | Extreme model | About 5% | Not reported |
Note: "Extreme model" refers to the Snapdragon 8 Elite Extreme Gen 6, and "standard model" refers to the Snapdragon 8 Elite Gen 6. All figures come from Samsung's internal testing as reported by ChosunBiz and include approximate values. It is unclear whether the CPU and GPU evaluation conditions were identical, and the specific GPU test names, APIs used, and resolutions have not been disclosed.
The notable point is that the gap changes significantly depending on the comparison target. In Geekbench 6.5, the Exynos 2700 beats the Snapdragon Extreme model by about 20%, while the gap against the standard model widens to 44%. However, the 44% figure against the standard model cannot be treated as the gap against the Extreme model. Saying only that it is "44% faster than Snapdragon" obscures the difference in comparison targets and could mislead readers about the actual gap.
Also, a simple calculation from the reported scores of about 13,000 and about 11,000 puts the Exynos 2700 about 18.2% ahead. Because both scores are approximate, however, that 18.2% cannot be treated as an exact measured result. It does not contradict the reported "about 20%," and since the original measurements have not been published, the margin cannot be pinned down to decimal places.
Caution is also needed regarding the Geekbench versions. The gap against the Extreme model is reported as about 20% in Geekbench 6.5 and about 15% in Geekbench 7.0, but this does not mean the Exynos 2700's performance declined over time. These are comparisons using different benchmark versions, and the absolute Geekbench 7.0 scores have not been shown. The two figures cannot be placed on the same scale to judge improvement or decline in performance.
GPU results likewise vary by what is evaluated. The Exynos 2700 reportedly beat the Extreme model by about 20% in maximum processing performance in demanding games using the latest technology, but the gap was only about 5% in basic graphics computation performance in typical demanding 3D games. Specific game titles and benchmark names have not been disclosed. These results therefore cannot be used to estimate frame-rate differences in actual games or to conclude that the chip excels at specific features such as ray tracing.
Improved HPB heat-dissipation design could affect sustained performance
According to ChosunBiz, the Exynos 2700 is designed by Samsung's System LSI division and is expected to be manufactured on Samsung Foundry's second-generation 2nm process, "SF2P." The report also says the "Heat Path Block (HPB)," which helps dissipate heat efficiently, will be improved to boost both thermal and processing performance. These are development-related reports, however, and the name of a manufacturing process alone does not allow conclusions about actual performance gains or production yields.
The HPB is a component that efficiently conducts heat generated by the processor outward. Its mechanism is explained in detail in Samsung's technical article on the previous-generation Exynos 2600. In conventional package structures, the DRAM placed on top of the processor impeded heat transfer from the heat source to the outside. Samsung changed the DRAM placement and installed a copper HPB above the processor's heat-generating area, making it easier to transfer heat to the device's cooling components.
The goal of this design is to dissipate the processor's heat efficiently and maintain stable performance under high load. A smartphone SoC may deliver high performance in short bursts, but when the load continues and temperatures rise, clock speeds and power consumption can be restricted to prevent overheating. If the HPB improves the heat-dissipation path, it may help reduce such performance drops. However, Samsung's technical article concerns the Exynos 2600 and is not a measured account of how much improvement has been made for the Exynos 2700.
The official Exynos 2600 product page states that the HPB-equipped package structure reduces thermal resistance by up to 16%. According to the footnote, the comparison is against the Exynos 2500, and the figure is based on Samsung's internal testing. Actual results are said to vary with operating conditions, and the 16% figure cannot simply be applied as the improvement rate for the Exynos 2700.
A 16% reduction in thermal resistance also does not mean the chip's temperature drops 16% or that battery life extends 16%. Thermal resistance is a measure of how hard it is for heat to travel, and it differs from the amount of power the processor needs for its workload. Even if heat dissipation improves, actual operating characteristics depend on whether the headroom is used to reduce power consumption or to sustain higher clock speeds.
The reported benchmark scores and HPB improvements alone are therefore not enough to judge the Exynos 2700's power efficiency or sustained performance. Evaluating power efficiency requires comparing performance and power consumption when running the same workload. Confirming sustained performance requires applying a load over a set period and measuring how performance changes as temperature rises. The HPB improvements raise expectations for better performance under prolonged heavy loads, but their effect awaits verification on real devices.
Galaxy S27 performance hinges on power and cooling conditions in the final product
The report states that the Xiaomi 18 Pro Max was used in the comparison tests, but the test device and chip implementation on the Exynos 2700 side have not been disclosed. It therefore cannot be concluded that the Exynos 2700 was tested inside a Xiaomi smartphone, and it is unclear whether both processors were compared in the same chassis or cooling environment. The comparison with the standard Snapdragon cites the Xiaomi 18 Pro, so the compared chips and the devices used need to be considered separately.
Furthermore, the report does not present publicly available Geekbench result IDs or official test logs. CPU clock speeds, power consumption, cooling conditions, test duration, and the number of repeated measurements are also unknown. Without this information, it is difficult for third parties to reproduce the reported gaps under the same conditions. This does not mean the test results are wrong; it is simply a limitation when extending internal test results to evaluating the final product.
ChosunBiz mentions the Galaxy S27 series, expected to appear in early 2027, as a product that may adopt the Exynos 2700. However, it has not been settled which models in the series will carry the Exynos 2700, whether Japanese models will use it, or whether the Galaxy S27 Ultra will also be equipped with it. A report that it beat a competing product in internal tests should be judged separately from the configuration of devices that actually go on sale.
To gauge the Exynos 2700's true capability, it will be important first to compare final-product devices against Snapdragon-equipped models using the same benchmark versions and common test conditions. Power consumption and cooling conditions then need to be disclosed, and it must be confirmed whether the performance gap holds not just in short-term peak performance but also under prolonged heavy loads. If repeated measurements confirm reproducibility, it will also become easier to assess how much the reported CPU gap of about 20% affects app use, gaming, and battery life in practice. For now, the Exynos 2700's performance is at the stage of encouraging reported results, and the focus going forward will be its adoption in the Galaxy S27 series and performance measurements on real devices.