Category
Rapidus, a Japanese chipmaker with no history of mass production, is targeting 2nm semiconductor manufacturing by combining technology licensed from IBM and imec, a wafer-by-wafer production method called RUMS, and roughly 2.9 trillion yen in government backing. This article traces that strategy against the 36-year decline of Japan's chip industry since 1988.
Cloudflare redesigned the DNS cache underpinning 1.1.1.1 in five stages, cutting fleet-wide memory usage by roughly 100TB. Packing data contiguously also improved insertion speed and lookup latency.
Salesforce announced 'Claudeforce,' a partnership letting users operate its own CRM directly from within Claude, alongside its earnings release on August 26, 2026. In that same earnings report, gains on strategic investments accounted for $2.53 of the $5.90 adjusted EPS, deepening the company's reliance on Anthropic on both the product and financial sides.
NTT, Japan's telecom giant, is pushing optical wiring deeper into semiconductor packages. Here's why the smallest connections—between dies—take until 2032, even as board-to-board links go commercial far sooner, and what that gap reveals about chip manufacturing precision.
Reaching the Pixel 11 Pro XL's 45W charging speed requires both a 21V PPS-compatible adapter and Super Fast Charging mode enabled. Based on measured differences between standard and dedicated charging modes, this article explains what to check after purchase.
A U.S. federal court has ruled the Pentagon's designation of Anthropic as a national security supply chain risk unlawful and vacated it. Here's what the ruling rejected—and what's still unresolved in AI procurement contracts—based on primary court documents.
X identified a roughly 200,000-account "bot farm" suspected of ties to China. Only 200 of those accounts posted about AI and power policy, underscoring the need to assess scale and actual impact separately.
A modder extracted a pre-release DLSS 5 runtime and ran it in Skyrim. Here's why the resulting image quality and frame rate changes can't be mistaken for official integration or final performance.
Intel says defect reduction on its upcoming 14A process is outpacing internal targets, with progress not seen since its 22nm node. Internal product design and customer capacity talks are advancing, but absolute defect rates and design wins remain unconfirmed.
SK hynix has started construction on an HBM advanced packaging plant in Indiana, where Korean-made wafers will be stacked and tested for US customers. Mass production is now targeted for late 2029, about a year later than originally planned.
