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A deep-dive investigation into how Google, Meta, Amazon and other content and cloud companies—none of them telecom carriers—came to consume 75% of international submarine cable bandwidth, and how a two-tier structure has emerged in which ownership and manufacturing are split: France's Alcatel Submarine Networks, America's SubCom, and Japan's NEC together control 92% of cable production.
CableLabs is urging the industry to adopt RSN Override support after finding that combining Wi-Fi 7 with WPA3 can disconnect older devices. Under single-SSID compatibility workarounds, devices lacking RSNO support fall back to Wi-Fi 6 or 6E equivalents depending on band.
AI glasses detection apps can infer a device's presence from Bluetooth signals, but they cannot confirm whether it is actually recording. This piece examines the missing shared signal that would let bystanders verify recording status, along with the tracking risks that standardization could introduce.
Rapidus has published a roadmap to build an 8-reticle (6,640 mm²) interposer on a 600×600mm glass panel by 2030. Claiming more than 12 times the yield efficiency of a 300mm wafer, the company is pursuing a manufacturing approach distinct from TSMC's wafer-based route to scale up AI chips.
NVIDIA says Claude Opus 5, running on its proprietary AVO agent framework, achieved a perfect score on the public ARC-AGI-3 benchmark, versus roughly 30% for the model alone under different measurement conditions. We examine how this points to a structural shift in which harness design—not the underlying model—increasingly determines real-world AI performance, and why it also serves NVIDIA's push to expand GPU demand.
Fire safety for battery storage systems—now deployed at 108 GW annually worldwide—has reached a turning point in design philosophy. UL 9540A's sixth edition introduces full-scale burn testing and pass/fail criteria, while research on mechanical-signal-based early detection of thermal runaway has improved warning lead time by 69.6%. Lessons from the Moss Landing fire are reshaping both standards and technology.
A University of Tokyo research group has used adjacent atomic columns in a silicon crystal—spaced 136 pm apart—as a natural double slit, publishing in Nature an interferometric measurement that shrinks Young's experiment by a factor of 10 million. By reading the visibility of the interference fringes, the method quantifies the stiffness of atomic bonds and their correlated thermal vibrations, potentially offering atomic-level insight for heat-dissipation design in semiconductors.
OpenAI accelerated enterprise revenue run-rate and API spending growth in Q3, but Anthropic still leads on annualized revenue. The two companies' figures use different metrics and can't be compared directly.
As AI chip TDPs exceed 1 kW and liquid-cooling adoption jumps from 6% to 53% in three years, thermal management has replaced raw performance as the top constraint in semiconductor design. From imec's STCO research to Samsung's zHBM concept and KAIST's AI design agents, here's a look at the front lines of the battle against heat.
LG Electronics PRI has reportedly received its first order for a semiconductor packaging LDI tool from an unnamed OSAT. Confirming mass-production adoption still requires details on throughput, overlay accuracy, and yield after delivery.
