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Explore English articles about Data Centers.
OpenAI reportedly expects a cumulative $278 billion cash outflow through 2030, even as it grows revenue roughly tenfold. Amazon's SEC filing and the CFO's remarks shed light on upfront compute commitments, how investments are actually being funded, and what it takes to turn efficiency gains into profit.
onsemi has announced EPP, which embeds power and control semiconductors in silicon. We examine the redistribution layer and cooling design, the baseline behind the 3–5x power density claim, and the early evaluation with SUBARU.
AMD's market capitalization has surpassed $1 trillion, with its stock price crossing $600. This milestone aligns with the final target share price set in warrant agreements covering up to 6GW of deployments with OpenAI and Meta, as AI infrastructure contracts and EPYC-driven agentic computing platforms boost the company's valuation.
The European Commission proposed on September 21, 2026, an A-to-G energy efficiency rating system for data centers rated at 500kW or above, with the top grade requiring a PUE of 1.15 or lower. Electronic labels will be automatically generated and published starting August 15, 2027.
A Taiwanese report links Intel and AUO on Micro LED optical links and glass-core substrates. We check AUO's announcements and Intel's patent to separate what is confirmed from what is not, and what would show real progress.
Generic MLCCs in Shenzhen have fallen about 66.7% from their late-June peak, while some orders for AI-grade high-performance MLCCs from Chinese makers extend into Q2 2027. This piece unpacks primary sources to explain how price declines and shortages can occur simultaneously across different price tiers and manufacturing processes.
AMD published detailed performance data for its EPYC 9996, claiming up to 3.7x gains over Intel Xeon and a 2.24x edge over NVIDIA Vera. We examine the configuration differences and an unresolved numerical discrepancy behind the headline figures.
Tesla, SpaceX and SpaceXAI have sued for a declaration that the Terafab name does not infringe TERA-print's trademark. We compare the filings in the complaint and look at TERA-print's technology and USPTO guidance to see why scale alone won't settle the dispute.
NVIDIA disclosed data on DSX power efficiency at the September 2026 AI Infra Summit. Lambda's real-world test on a 5-rack, 19-node cluster showed a 24% increase in token throughput, while a utility signal-triggered reduction cut just 1 megawatt at a single facility. This piece separates those measured results from the headline-grabbing 'up to 40%' projection found in NVIDIA's materials.
Electronic Times reports that lead times for some chip equipment parts have reached 40 months. Three anonymous cases and SEMI's official outlook show how parts procurement, tool delivery and effective fab capacity differ.
