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Explore English articles about Data Centers.
Huawei has demonstrated a 7.2Tbps NPO optical module in transmission. We compare how NPO and CPO place optical components, and what NVIDIA and Broadcom's official announcements say about each product's stage, to examine supply and maintenance conditions.
Panmnesia and Meta have unveiled a next-generation AI infrastructure design that uses CXL to tightly couple an entire data center as if it were a single chip. The architecture cuts cross-rack communication latency to a few hundred nanoseconds and forms a shared memory space spanning up to 960 accelerators.
A close look at the SEC filing behind Qualcomm and Amazon's AI chip partnership warrant terms. Why the reported $60 billion figure doesn't mean confirmed orders, and how this fits alongside AWS's existing chip strategy.
Huawei's two-layer stacked Kirin 2026 reportedly delivers major power savings at equivalent performance. But at peak performance, power density exceeds the previous generation, and absolute junction temperature figures remain unpublished.
An examination of KIOXIA's CXL-based memory expansion module XL1, based on September performance simulations and August shipment plans, clarifies how it divides roles with the GP1 and CM10 product lines.
Bloomberg reports that DeepSeek plans to deploy at least 160,000 Huawei Ascend 950DT chips at a 1GW-class data center in Inner Mongolia. The chips will be used for inference only; training remains on NVIDIA. The 160,000 figure represents roughly 30% of Huawei's published cluster configuration, with component supply—not compute capacity—constraining delivery.
A sharp rise in NAND prices has expanded the market, allowing Samsung to keep its lead. Two charts compare vendor revenue shares and enterprise SSD demand, and explain how the trend is spilling over into PC pricing.
This article compares Micron's proposed GPU-adjacent NAND with the company's HBM4, PCIe 6.0 SSDs, and the OCP HBF standard, examining the performance and implementation requirements needed for productization.
Broadcom's AI chip revenue now accounts for more than half of total company sales. Drawing on primary sources, we examine the growth in custom XPUs and networking, the terms of its rack financing deals, customer concentration, and supply constraints.
Google and geothermal startup Fervo Energy have signed a deal to procure 396MW from Fervo's Cape Station in Utah. With an expansion option to 1GW and a direct-to-load framework enabled by Utah's SB132, the deal powers AI facilities at no cost to existing ratepayers.
