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Explore English articles about Semiconductor Manufacturing.
ASML CEO Christophe Fouquet expects AI's impact to unfold over 10 to 15 years. Company documents show the gap between expanding current EUV output and adopting High NA, plus supplier limits and AI use in chipmaking with Mistral AI.
Single-crystal films of 10% La-doped hafnia kept intrinsic antiferroelectric order under compressive strain down to 0.6nm. Here is what the 850±50°C figure means, and which performance metrics for energy storage, cooling and memory have yet to be measured.
TSMC's 1.4nm process (A14) is on track for trial production in 2027 and mass production in 2028. The company will forgo High-NA EUV in favor of Low-NA multi-patterning and NanoFlex Pro, while A13—arriving in 2029 with a 97% optical shrink—aims to deliver an edge in yield and cost efficiency.
ASM has unveiled a carbon film that fills trenches and flattens the surface in a single PECVD process, and says early production adoption has begun. We trace its development since 2023 and look at the performance figures that remain undisclosed.
Nexstrom, which is building a tool to grow 2D TMD material directly on 300mm wafers, has raised $12 million in seed funding. Company materials claim 300mm has been achieved, yet the CEO says 12-inch work will be completed by the end of October. We examine its position through growth temperature and imec's adoption timeline.
AMD's market capitalization has surpassed $1 trillion, with its stock price crossing $600. This milestone aligns with the final target share price set in warrant agreements covering up to 6GW of deployments with OpenAI and Meta, as AI infrastructure contracts and EPYC-driven agentic computing platforms boost the company's valuation.
The US has proposed that China adopt a system for notifying each other of AI incidents that affect national security. We compare the public records from both sides and earlier talks, then use the OECD reporting framework to examine what will determine whether such a system works: notification criteria, shared information and more.
TSMC Co-COO Y. J. Mii described the limits of AI in advanced process development. Drawing on official materials, we trace AI-assisted design work for A14 and its use in fabs, and explain how optimizing circuits differs from establishing a new manufacturing process.
Tesla, SpaceX and SpaceXAI have sued for a declaration that the Terafab name does not infringe TERA-print's trademark. We compare the filings in the complaint and look at TERA-print's technology and USPTO guidance to see why scale alone won't settle the dispute.
Electronic Times reports that lead times for some chip equipment parts have reached 40 months. Three anonymous cases and SEMI's official outlook show how parts procurement, tool delivery and effective fab capacity differ.
