Topic
Explore English articles about Semiconductor Manufacturing.
Construction at TSMC's Taichung Fab 25 is reportedly accelerating, with equipment trial runs said to begin in April 2027, yet the company's official guidance still points to a 2028 mass-production start. This article examines the gap between building completion and process qualification using primary local sources.
After seven years in stealth, US startup Kepler Computing has unveiled a ferroelectric AI memory technology built without EUV lithography, instead retrofitting existing 28nm fabs. The company is targeting SRAM-level power efficiency with up to 10 times the capacity of HBM, aiming to break through AI infrastructure's memory supply constraints.
Japan Display's closed Mobara plant is drawing competing bids from U.S. memory giant Micron and major Korean semiconductor substrate makers. Talks are advancing at roughly 500 billion won (about ¥55 billion), with the site's Gen 6 building and power infrastructure eyed for conversion to advanced packaging and data center use.
China's AlkaidSemi has unveiled the world's first SiC superjunction MOSFET rated at 1,635V. The device achieves zero on-resistance temperature drift in its practical operating range and a 166% boost in high-temperature current density, targeting power-density breakthroughs in AI data center power delivery and EVs.
Panmnesia and Meta have unveiled a next-generation AI infrastructure design that uses CXL to tightly couple an entire data center as if it were a single chip. The architecture cuts cross-rack communication latency to a few hundred nanoseconds and forms a shared memory space spanning up to 960 accelerators.
Samsung and TSMC are moving toward High-NA EUV mass production before the larger photomask standard is finalized. Their 2028–2033 roadmaps reveal a two-stage transition: capturing resolution gains first, then boosting throughput later.
We examine what Intel's cumulative 1 million wafers on High-NA EUV reveals about process learning, and unpack the 2030-2033 roadmap ASML and TSMC have set for moving to 12-inch photomasks along with the constraints on mass production.
France's Mistral AI has raised a record €3 billion for Europe, led by Samsung Electronics. The two companies will jointly develop dedicated models for defect detection and yield stabilization, running in air-gapped, on-premise environments inside semiconductor fabs that require strict confidentiality, advancing the practical rollout of sovereign AI.
Starting from reports of an approximately 10% October price hike on Intel's PC CPUs, this article traces the pattern of incremental price revisions and server-first supply allocation, examining the shift toward prioritizing gross margins and the conditions—such as 18A and 14A mass production—needed to resolve ongoing supply constraints.
China's NAURA presented a SiGe/Si selective etching technology for 3D DRAM at CSTIC 2026, claiming over 500x selectivity at 64 layers—but the equipment model, throughput, and CXMT adoption remain undisclosed and unverified.
