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Explore English articles about Semiconductor Manufacturing.
China's NAURA presented a SiGe/Si selective etching technology for 3D DRAM at CSTIC 2026, claiming over 500x selectivity at 64 layers—but the equipment model, throughput, and CXMT adoption remain undisclosed and unverified.
A team led by Hong Kong Polytechnic University has developed a tunnel FET using a 2D bismuth/InSe heterojunction that achieves both steep switching below the Boltzmann limit (60 mV/dec) at room temperature and a practical on-current.
MediaTek is expanding its advanced packaging hiring. Job postings and technical documents reveal a plan to unify AI ASIC design, mass production, and procurement under one roof.
Examining Goldman Sachs's forecast that China's sub-7nm wafer supply shortfall will shrink to 34% by 2035, using primary sources and related data to assess capacity expansion, yield improvements, export controls, and technology-generation gaps.
TSMC's advanced packaging technology CoWoS expanded monthly production capacity roughly ninefold in three years, yet a supply-demand gap of about 10% still remains. Drawing on primary sources and multiple estimates, this piece examines two constraints: the physical limits of yield and the supply-chain structure in which NVIDIA secures the majority of capacity.
Rapidus, a company with no mass-production track record, is attempting to reach the 2-nanometer chip generation by combining technology transfers from IBM and imec, a production method called RUMS, and roughly ¥2.9 trillion in government support — explained alongside the 36-year decline of Japan's semiconductor industry since 1988.
Samsung Electronics has published a paper in JVST A on the challenges of extending atomic layer etching (ALE) — a technology with production experience since 2017 — into low-k material processing. This piece examines the technique's 90-degree vertical profile advantage, the new hurdle of chemical damage, and how it differs from Japanese company SAMCO's approach.
Fujitsu's 144-core MONAKA 3D-stacks N2P compute cores with N5 SRAM and I/O. Ahead of 2027 shipment, estimated performance and stacking still need real-world verification.
RIKEN and collaborators have demonstrated a multi-laser irradiation method for generating EUV light from a 2µm solid-state laser. Using a tin flat-plate target, the technique raised conversion efficiency from 2.6% to 3.6% at the same total energy.
Nikkei Asia reports that China has been quietly delaying customs clearance for germanium and quartz-based materials shipped to Taiwan since 2025, without any public notice. Some shipments have been delayed by months, and some Taiwanese suppliers have lost orders. This piece examines the tactic of "silent restriction," which is hard to challenge legally or route around, and explores how the resulting demand could shift toward Japanese quartz glass makers.
