テクノロジー
iPhone 18 ProのA20 Pro、2nm製造とWMCMを同時採用で大きな飛躍を遂げるか
iPhone 18 Pro向けA20 ProにはTSMCのN2とWMCMの同時採用が予測される。注目は公称値ではなく、実機の消費電力と持続性能にどう表れるかだ。
Term
InFO
別名: InFO
Overview
最終更新: 2026年7月9日Integrated Fan-Out (InFO) is a wafer-level packaging technology developed by TSMC. It allows for high-density integration of chips with a thinner profile and improved thermal and electrical performance by eliminating the need for a traditional package substrate.
Mentioned Articles
1 件External Mentions
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