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Bosch has begun sample production of silicon carbide semiconductors using 200mm wafers at its US plant, aiming for commercial production sometime in 2026. Backed by substantial public support, the facility is set to become one of the largest of its kind in the US, but amid a slowdown in the EV market and rising competition, success will hinge on yield improvements and capacity utilization.
On July 14, 2026, Google DeepMind CEO Demis Hassabis proposed an independent FINRA-style AI standards body. Here is how it differs from the FAA-style regulation Dario Amodei has urged, against the backdrop of ad hoc government model suspensions in June.
New York State has issued the first statewide executive order in the U.S. to suspend, for up to one year, permits for large data centers consuming more than 50MW of power. Citing surging electricity demand driven by AI, the state is moving quickly to establish new regulations and environmental standards that would shift grid-expansion costs onto operators. (119 characters)
KeyBanc projects that Intel will manufacture 80-90% of Nova Lake tiles in-house on 18A. We examine the 18A improvements confirmed in official disclosures and the conditions under which reduced TSMC reliance would affect gross margin and supply capacity.
US-based TYLsemi has unveiled a chiplet and volume-production support model that standardizes the surrounding functions of AI chip development. By providing reusable dies that handle I/O and power delivery, the company says customers can focus solely on their proprietary compute circuit designs, enabling significant reductions in development time and cost.
Google is introducing a personalized gallery to desktop Google Images in the US that updates based on user interests. AI Overviews also gains image generation powered by Nano Banana 2 Lite.
Lucid denied reports of considering bankruptcy or going private, but its roughly $4.7 billion in liquidity relies heavily on a PIF-affiliated credit facility and a recent capital raise. Over $1.4 billion in Q1 cash burn and production improvement will be tested at the August 4 earnings report.
Microsoft has merged into master a design that isolates WSL 2's user processes with cgroup v2, preserving resources for core processes even under heavy load. The change is not yet in the latest pre-release, leaving distribution timing and cgroup v1 compatibility as open questions.
Shanghai-based Dongfang Suanxin has unveiled the DF1000, an AI chip that combines a 14nm process with 3D stacking technology against the backdrop of US export controls. Its design vertically stacks logic circuits and DRAM to achieve high memory bandwidth, but mass-production yield and building a practical software ecosystem remain challenges ahead.
Samsung has launched an experienced-hire recruitment drive spanning HBM design, packaging, and customer qualification. With an eye on scaling up HBM4 production and developing next-generation products, the company aims to strengthen coordination across processes to shorten development timelines and improve mass-production yields, boosting its competitiveness in the AI memory market.
