
The Modulator That Boosted Optical Interconnect Bandwidth 2-3x Is Now Moving Toward Real-World Manufacturing
Micro-transfer printing technology, which fabricates light-emitting and modulator materials incompatible with silicon separately before transferring them, is drawing attention. It leverages the advantages of CMOS processes while enabling high-precision integration of high-performance lasers and modulators on the same chip, positioning it as a promising foundation for next-generation high-speed communications.








