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Databricks' internal benchmark revealed a cost reversal: Sonnet 5, despite its lower per-token price, cost more per task than Opus 4.8. We unpack the structure—driven by completion rates and harness selection—alongside Uber's budget overrun case.
Reports have surfaced that the Pixel 11's Tensor G6 will use TSMC's 2nm process. Drawing on clues about a 7-core CPU and a MediaTek-based modem, we examine how power might be allocated across the SoC as a whole.
Intel's space-oriented SoC "Starfire" targets up to 75 TOPS using 18A and Foveros, but radiation tolerance figures and spaceflight qualification remain undetermined. Judging its real capability will have to wait for Q3 2026 samples and test results.
Meta is expanding its Hyperion facility in Louisiana to over $50 billion and 5GW. Here's a breakdown of the investment structure that incorporates outside capital, the ten planned gas power plants, and the regulatory review over rate protections.
Intel is adding €5 billion in additional investment at Leixlip, Ireland. Combined with the $14.2 billion equity buyback three months earlier, roughly $19.9 billion is now concentrated there—while the new-fab plans in Germany and Poland have been completely scrapped. The reality of Intel's European strategy lies in "selection and concentration."
The Samsung-targeted 2nm design for Tesla's AI5 has reached tape-out. With production planned for 2027, the next checkpoints are prototyping, qualification, yield, and parity with the TSMC version.
SK hynix's CEO has forecast the worst memory supply shortage in history for 2027. While AI demand spreads beyond HBM into DRAM and NAND, the expanded production facilities in Yongin and Cheongju will only come online gradually between 2027 and 2029.
On June 25, 2026, Google submitted comments to the EU Copyright Directive review opposing DNS, IP, and VPN blocking. We examine the timing—just three months after losing in a French appellate court—and the parallel dynamics of regulatory expansion and judicial pushback unfolding simultaneously in the EU and the US.
As demand for advanced packaging technology for AI semiconductors surges, TSMC is expanding outsourcing to and cooperation with external companies to resolve its supply shortage. This situation is creating business opportunities for Intel's competing technology and for the proprietary packaging methods of Taiwan's OSAT companies, reshaping the balance of power in the supply chain.
A research group at the University of Tokyo has developed, for the first time in the world, a technology that reads and writes the magnetic information of a single atom using only quantum mechanical "force," without using any electric current whatsoever. Because this method can prevent heat generation from Joule heating as well as malfunctions, it represents a groundbreaking achievement toward realizing the ultimate high-density memory.
