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The new MCP spec, slated for publication on July 28, 2026, eliminates initialization and the protocol session. While it lightens cloud deployments, authorizing state handles and designing for old-new compatibility become challenges for implementers.
NVIDIA has reportedly raised procurement prices again for GeForce GPUs and VRAM, this time expanding the scope to include GDDR6 products. Model numbers and the size of the price increase remain unannounced, and it is unclear when the change might reach retail.
Amazon has cut jobs in part of its organization referred to as AGI. The company continues roughly $200 billion in capital expenditures while narrowing down model development priorities and reshuffling staff allocation.
Mitsubishi Electric and Sony Semiconductor Solutions are planning a joint venture that links in-sensor AI to factory automation decision-making and control. The companies aim to launch the business in October 2026, though product specifications and release dates remain unannounced.
To prepare for the loss of passkeys and other credentials, Google has introduced an account recovery feature that uses AI-powered selfie videos to verify identity. By requiring users to turn their heads side to side, the system is designed to detect deepfakes, and by eliminating the need for specialized sensors, it enables secure recovery across a wide range of devices.
Anthropic has added Opus and Sonnet to the paid tiers of Claude's voice mode. While it now extends to connected tool operations and Japanese, Free remains locked to Haiku, Fable is excluded, and voice retention conditions remain unclear.
Hitachi and Intel have been selected as prospective contractors for a NEDO project, moving forward to develop a 100-qubit-class silicon quantum computer using the 18A-based process and a qubit PDK. The plan calls for integrated development of manufacturing, packaging, and cloud operation.
While Google begins selling TPUs externally, it has set cutting-edge AGI development as the top priority in its compute resource allocation. The company is weathering supply shortages through sales to customer facilities and procurement of external capacity.
Micro-transfer printing technology, which fabricates light-emitting and modulator materials incompatible with silicon separately before transferring them, is drawing attention. It leverages the advantages of CMOS processes while enabling high-precision integration of high-performance lasers and modulators on the same chip, positioning it as a promising foundation for next-generation high-speed communications.
Driven by the growing capacity of nearline HDDs for AI, Resonac and other Japanese component makers have moved to increase production. Even as overall unit shipments decline, investment in recording media, heads, and glass substrates is expanding.
