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Explore English articles about Memory & Storage.
Chinese DRAM giant CXMT is reportedly producing small quantities of HBM3E, with Alibaba's T-Head and Cambricon testing it for adoption. Before any 2027 deployment, customer qualification, yield, and supply volume still need to be confirmed.
Researchers from Meta AI and UIUC propose EvoHarness-RL, which trains AI agents to decide when to access external memory. On ALFWorld's in-distribution 140 tasks, Qwen3-8B achieved a 96.9% average success rate.
This analysis separates CXMT's U.S. lawsuit into two threads—its commercial DRAM specifications and the evidence of ties to MIIT and SASAC—while examining the review standards set by three recent rulings and the federal procurement restrictions that would remain even if CXMT wins its Section 1260H case.
South Korea's DRAM export unit price hit $92,183 per kilogram in August 2026, up 401% year-on-year, a value now matching about 620 grams of gold. Samsung and SK hynix's shift toward prioritizing HBM production has starved the general-purpose DRAM supply, sending price increases cascading from NVIDIA's AI servers to VAIO's PCs.
CXMT has announced the start of LPDDR6 mass production and its adoption in the Xiaomi 18 Fold. This article examines the 12.8Gbps specification against primary sources, along with still-unknown details on yield and supply scale.
We examine the truth behind claims that a 2010 SanDisk SSD survived 9PB of writes. Rather than physical NAND wear, the test exploited the drive's cache layer to stress the controller—revealing blind spots in SMART diagnostics.
SK hynix has started construction on an HBM advanced packaging plant in Indiana, where Korean-made wafers will be stacked and tested for US customers. Mass production is now targeted for late 2029, about a year later than originally planned.
Kioxia and SanDisk's planned ¥5 trillion Japan investment through 2032 hinges on four factors: a new Kitakami plant, joint-venture cost-sharing, 332-layer NAND technology, and government backing.
TechInsights' physical analysis confirms that China's CXMT has adopted High-k Metal Gate (HKMG) technology in its G4 DRAM process and LPDDR5X products. Drawing on patents and comparisons with rivals, this piece examines what the finding actually proves—and the multi-patterning, yield, and equipment hurdles still standing between CXMT and mass production of its next-generation G5 node.
Qualcomm's High Bandwidth Compute technology is reportedly gaining support from Samsung and SK hynix. The design, which moves computation closer to memory, will be tested with AI250 samples and third-party verification in mid-2027.
