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Explore the latest semiconductor news and technology.
Edgewater Research has suggested a multi-year memory contract between NVIDIA and Micron. While the companies' mass-production relationship and Micron's anonymous strategic customer agreements are already public, the contract's duration, volume, and pricing remain unconfirmed.
Rapidus has published a roadmap to build an 8-reticle (6,640 mm²) interposer on a 600×600mm glass panel by 2030. Claiming more than 12 times the yield efficiency of a 300mm wafer, the company is pursuing a manufacturing approach distinct from TSMC's wafer-based route to scale up AI chips.
A University of Tokyo research group has used adjacent atomic columns in a silicon crystal—spaced 136 pm apart—as a natural double slit, publishing in Nature an interferometric measurement that shrinks Young's experiment by a factor of 10 million. By reading the visibility of the interference fringes, the method quantifies the stiffness of atomic bonds and their correlated thermal vibrations, potentially offering atomic-level insight for heat-dissipation design in semiconductors.
As AI chip TDPs exceed 1 kW and liquid-cooling adoption jumps from 6% to 53% in three years, thermal management has replaced raw performance as the top constraint in semiconductor design. From imec's STCO research to Samsung's zHBM concept and KAIST's AI design agents, here's a look at the front lines of the battle against heat.
LG Electronics PRI has reportedly received its first order for a semiconductor packaging LDI tool from an unnamed OSAT. Confirming mass-production adoption still requires details on throughput, overlay accuracy, and yield after delivery.
AMD's x86 client CPU shipment share rose to 30.3%. Cross-checking both companies' 10-Q filings shows AMD gained on unit volume while Intel gained on average selling price, meaning share alone doesn't capture the full competitive picture.
An examination of Commercial Times' report on Razor Lake's possible adoption of TSMC's N2X, checked against official Intel 18A-P and TSMC materials plus a separate correction record, explains why the manufacturing split can't yet be confirmed.
Sandisk has announced the SATA-based NAS 600 and PCIe 5.0-enabled NAS 800. Here's how they differ from the previous WD Red generation, and what NAS-side factors limit their rated speeds.
CXMT will account for 11.3% of the world's net DRAM bit supply growth in 2026, but Hanwha forecasts that shortages will continue through 2027 even after the production increase. Here's how to read the denominators and supply constraints behind the numbers.
SK hynix and collaborators have published a peer-reviewed technical roadmap for co-packaged optics. The plan to extend optical connections eventually to shared memory pools would push AI infrastructure bandwidth design beyond HBM.
