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Explore the latest semiconductor news and technology.
China's Institute of Microelectronics reportedly built a GAA transistor path toward sub-3nm nodes without relying on EUV. But a 500,000 on-off ratio only confirms single-device performance—key questions on power, performance, area, interconnects, and yield remain unanswered.
GlobalFoundries and Marvell are expanding U.S. manufacturing of SiGe chips for optical connectivity. Here is what the electrical circuits do, and what still has to fall into place as the industry moves toward NPO and CPO.
DRAM maker CXMT is reportedly planning a NAND research and development line in Beijing and talking with potential customers, according to Reuters. Here is what the report confirms, and what remains unknown before any commercial supply.
Huawei is dividing its Ascend 960 AI accelerator into separate training and inference chips, accelerating the rollout by up to nine months. Official documents reveal how the new Atlas 960E's proximity-mounted optics aim to cut power use and boost uptime—and where supply and software gaps remain.
AMD has notified partners that it will raise prices for AI chips, GPUs, and motherboard chipsets by roughly 10% starting in Q4 2026. The move, driven by rising TSMC manufacturing costs, coincides with Intel's earlier price hike and is set to push up overall BOM costs across the DIY PC market.
NVIDIA CEO Jensen Huang predicted China will reach advanced lithography technology by 2030. Cross-checking public records against ASML's development history reveals several milestones still separate prototype machines from mass production capability.
We checked the Geekbench 7 listings for the M6 and M5 Ultra against the raw data, comparing 20 Apple M-series configurations, eight rival CPUs and eight workload categories in five charts and several tables.
A report claims Apple is considering an enterprise AI server with multiple M8 Ultra chips and NVIDIA's NVLink Fusion. We examine the claim against Apple's current Mac clusters, Private Cloud Compute, and NVIDIA's official materials.
Reports say SK hynix may lease part of Intel's Ohio fab to make memory in the US. Here's how this compares to its Indiana back-end plant, what Intel's construction timeline implies, and the conditions—tooling, tech transfer, and qualification—that still stand between talks and production.
Intel CEO Lip-Bu Tan revealed in an official livestream that the company can supply only about 50% of the CPUs customers are requesting. While AI inference is pushing up CPU demand, three constraints—Intel's own fab capacity, memory, and semiconductor packaging substrates—are limiting supply.
