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Explore the latest semiconductor news and technology.
DDR4 2Gx8 branded chips pulled back and DDR5 demand cooled, but the mainstream 1Gx8 average rose 0.47% week over week. A look at why the product-level split—and suppliers' own disclosures—means spot softening can't yet be read as falling contract or retail prices.
Micron has announced the world's first demonstration of a 512GB DDR5 RDIMM. By stacking 32Gb dies with TSV technology, it achieves speeds up to 9,200 MT/s while cutting power consumption to 16.0W. With 24 slots, it enables 12TB of main memory, with mass production validation targeted for late 2027.
An anonymous leak claims next-gen GeForce, including an RTX 6090, is targeting early 2027. We examine that claim against NVIDIA's official launch cadence, Rubin architecture specs, and its supply and revenue disclosures.
In a live call, Trump dismissed AI doom fears but admitted caution is needed. Comparing his remarks to three administration documents reveals a policy line between rejecting a blanket halt and requiring targeted evaluation and verification.
MediaTek has announced the Dimensity 9600 Pro and Dimensity 9600M, SoCs built on TSMC's 2nm process. With an All Big Core design and Dual-NPU configuration, the chips lay the groundwork for next-generation agentic AI.
A report claiming an 80% yield for Intel 18A used in Panther Lake is examined against official Intel and ASML materials, separating the unverified estimate from confirmed signs of high-volume production.
Chinese EDA firm Empyrean has shown how AI can shorten a circuit layout task, while also working on multilayer designs aligned with Huawei's Tau Law. This piece examines the remaining challenges around final verification, data, and computing resources as design automation expands.
Global semiconductor sales rose 31.4% quarter-on-quarter to more than $425 billion in the second quarter of 2026. This analysis breaks down memory prices, bit shipments, AI investment, and device demand to examine what's really behind the record—and what to watch for next.
Economic Daily News reports TSMC will expand 2nm and 3nm capacity by mid-2027, while a separate forecast sees CoWoS doubling by end-2028. We look at TSMC's response, monthly output figures, differing timeframes and its larger CoWoS plans to see what they mean for AI chip supply.
China's AI chip companies all posted strong sales growth in 2026, while NVIDIA's revenue from China-headquartered customers fell from 19.2% to 9.1% of total sales in a single year. Yet China's leading large language models are still being trained on NVIDIA hardware. This piece traces the reasons to two barriers: two decades of software assets built up around CUDA, and the physical ceiling imposed by HBM supply.
