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NVIDIA's $3.5 billion purchase of MediaTek convertible bonds is examined as a strategy linking MediaTek's advanced packaging capabilities with NVLink infrastructure, including how the funds will be used, the non-exclusive nature of the deal, and mass-production constraints.
We break down TSMC's projected "50x" leap by 2029 into the roles played by CoWoS, SoIC, and optical interconnects, examining where effective performance ends and mass-production conditions begin. We also clarify the difference between the 50% silicon photonics market forecast and actual CPO adoption rates.
モバイルバッテリーの充放電を支えるセルと保護回路を分け、内部短絡が熱暴走へ進む過程を解説。第三者検査で減らせる製造時の危険と、使用時に残る高温・衝撃のリスクを見分ける。
Researchers have demonstrated in the lab that static electricity of several thousand volts, generated when water droplets slide down an insulating surface, can electrically break down a metal's protective coating and trigger corrosion. The finding points to a new pathway for rain-induced corrosion distinct from chemical reactions or physical wear.
Broadcom's VMware AI Factory for AMD touts GPU sharing and usage visibility, but pricing, release dates, and measured cost reductions remain undisclosed, leaving key conditions for verifying the savings still missing.
Intel expects revenue from EMIB-T-based advanced packaging to grow starting late 2027 and scale up by 2029. Customer qualification, yield, and financial disclosure will determine whether the technology becomes a real external business.
A joint research team from the Karlsruhe Institute of Technology and the University of Tsukuba has demonstrated a solid-state elastocaloric cooling principle driven solely by heat input from an external source, combining two types of shape-memory alloy thin films. By eliminating bulky electric actuators, the team achieved milliwatt-scale cooling. This article explains the underlying physical mechanism and the challenges for future scale-up.
In a letter to the G20, Bank of England Governor Andrew Bailey warned that high valuations of AI-linked assets, growing investor borrowing and the concentration of capital in a few big tech companies could reinforce one another. With AI companies making up roughly half of the S&P 500, funding for capital spending has spread to corporate bonds, private credit and GPU-backed loans.
The European Commission has designated ChatGPT as a VLOSE and Reddit and Roblox as VLOPs under the DSA. Four months after notification, all three companies must comply with additional obligations, including systemic risk assessments and independent audits.
MediaTek is expanding its advanced packaging hiring. Job postings and technical documents reveal a plan to unify AI ASIC design, mass production, and procurement under one roof.
