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Explore the latest semiconductor news and technology.
Examining Goldman Sachs's forecast that China's sub-7nm wafer supply shortfall will shrink to 34% by 2035, using primary sources and related data to assess capacity expansion, yield improvements, export controls, and technology-generation gaps.
TSMC's advanced packaging technology CoWoS expanded monthly production capacity roughly ninefold in three years, yet a supply-demand gap of about 10% still remains. Drawing on primary sources and multiple estimates, this piece examines two constraints: the physical limits of yield and the supply-chain structure in which NVIDIA secures the majority of capacity.
This analysis separates CXMT's U.S. lawsuit into two threads—its commercial DRAM specifications and the evidence of ties to MIIT and SASAC—while examining the review standards set by three recent rulings and the federal procurement restrictions that would remain even if CXMT wins its Section 1260H case.
South Korea's DRAM export unit price hit $92,183 per kilogram in August 2026, up 401% year-on-year, a value now matching about 620 grams of gold. Samsung and SK hynix's shift toward prioritizing HBM production has starved the general-purpose DRAM supply, sending price increases cascading from NVIDIA's AI servers to VAIO's PCs.
The University of Texas at Austin and TSMC have fabricated SOT-MRAM on a 300mm wafer that operates at 2ns and 350fJ. Simulations based on real measured data reveal concrete challenges for practical edge AI deployment, including overcoming device-to-device variation.
CXMT has announced the start of LPDDR6 mass production and its adoption in the Xiaomi 18 Fold. This article examines the 12.8Gbps specification against primary sources, along with still-unknown details on yield and supply scale.
Rapidus, a company with no mass-production track record, is attempting to reach the 2-nanometer chip generation by combining technology transfers from IBM and imec, a production method called RUMS, and roughly ¥2.9 trillion in government support — explained alongside the 36-year decline of Japan's semiconductor industry since 1988.
NTT, Japan's telecom giant, is pushing optical wiring deeper into semiconductor packages. Here's why the smallest connections—between dies—take until 2032, even as board-to-board links go commercial far sooner, and what that gap reveals about chip manufacturing precision.
Intel says defect reduction on its upcoming 14A process is outpacing internal targets, with progress not seen since its 22nm node. Internal product design and customer capacity talks are advancing, but absolute defect rates and design wins remain unconfirmed.
SK hynix has started construction on an HBM advanced packaging plant in Indiana, where Korean-made wafers will be stacked and tested for US customers. Mass production is now targeted for late 2029, about a year later than originally planned.
