
PC GPU Shipments Reach 75.5 Million in Q2 2026, Led by Notebook Growth
A breakdown of JPR's Q2 2026 data showing 75.5 million PC GPU shipments, based on three charts covering notebook growth, desktop decline, and vendor market share.
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A breakdown of JPR's Q2 2026 data showing 75.5 million PC GPU shipments, based on three charts covering notebook growth, desktop decline, and vendor market share.

A look at predictions for iPhone 18 price increases, weighing rising memory component costs against pricing data from the past three generations. The analysis separates launch-day prices from current prices in Japan and examines how capacity changes and the arrival of a foldable model affect the cost of upgrading.

This piece tests China's RISC-V strategy against the myth of '2.5 billion units shipped' and real server procurement data. The true goal is to seize governance structures through board seats — and this analysis unpacks that reality through the vulnerabilities built into Arm and x86, and China's parallel bet on LoongArch.

A team led by Hong Kong Polytechnic University has developed a tunnel FET using a 2D bismuth/InSe heterojunction that achieves both steep switching below the Boltzmann limit (60 mV/dec) at room temperature and a practical on-current.

A leak based on solder pad layouts suggests Apple's A20 Pro could feature a 7-core GPU and a 96-bit memory interface. Compared with official Snapdragon and Dimensity specs, this piece examines what more execution units and data supply mean for sustained performance.

A sharp rise in NAND prices has expanded the market, allowing Samsung to keep its lead. Two charts compare vendor revenue shares and enterprise SSD demand, and explain how the trend is spilling over into PC pricing.

This article compares Micron's proposed GPU-adjacent NAND with the company's HBM4, PCIe 6.0 SSDs, and the OCP HBF standard, examining the performance and implementation requirements needed for productization.

Broadcom's AI chip revenue now accounts for more than half of total company sales. Drawing on primary sources, we examine the growth in custom XPUs and networking, the terms of its rack financing deals, customer concentration, and supply constraints.

Google is pulling DDR4 memory out of retired servers and reconnecting it to new-generation AI servers via a dedicated interface, turning component recycling into a supply-defense strategy amid a memory shortage.

TSMC is targeting 4,100W-class CoWoS packages and has already demonstrated uniform heat dissipation beyond 5kW in test vehicles. Here's what sealing, warpage, and rack integration reveal about the path to mass production of direct-to-silicon liquid cooling.