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Explore the latest semiconductor news and technology.
Samsung aims for 2x performance and a 20% cut in thermal resistance with HBM5. Meanwhile, zHBM's claimed "8x" improvement is reported against different baselines—HBM4E in some accounts, HBM5 in others—making disclosure of absolute bandwidth and test conditions the key to evaluating the roadmap.
We break down Apple's official performance multipliers for the M5 Max Mac Studio down to the footnotes, weighing the ¥170,000 domestic price increase from the M1 Max generation and the limits of pre-release benchmarks to determine which tasks actually benefit from upgrading.
The spot price of 36GB HBM3E has reportedly reached about $2,100 per unit, four to five times the long-term contract price. Samsung plans to allocate 60-70% of its memory production capacity to long-term contracts running through 2031, and whether a buyer is inside or outside those contracts is starting to determine the terms under which AI memory can be procured.
NVIDIA's $3.5 billion purchase of MediaTek convertible bonds is examined as a strategy linking MediaTek's advanced packaging capabilities with NVLink infrastructure, including how the funds will be used, the non-exclusive nature of the deal, and mass-production constraints.
We break down TSMC's projected "50x" leap by 2029 into the roles played by CoWoS, SoIC, and optical interconnects, examining where effective performance ends and mass-production conditions begin. We also clarify the difference between the 50% silicon photonics market forecast and actual CPO adoption rates.
Intel expects revenue from EMIB-T-based advanced packaging to grow starting late 2027 and scale up by 2029. Customer qualification, yield, and financial disclosure will determine whether the technology becomes a real external business.
MediaTek is expanding its advanced packaging hiring. Job postings and technical documents reveal a plan to unify AI ASIC design, mass production, and procurement under one roof.
EPFL's GaN-on-Si polarization super-junction blocked 3.4 kV in a normally-off device. A separate normally-on device kept dynamic on-resistance increase under 15% even after 3 kV stress.
Chinese DRAM giant CXMT is reportedly producing small quantities of HBM3E, with Alibaba's T-Head and Cambricon testing it for adoption. Before any 2027 deployment, customer qualification, yield, and supply volume still need to be confirmed.
Examining Goldman Sachs's forecast that China's sub-7nm wafer supply shortfall will shrink to 34% by 2035, using primary sources and related data to assess capacity expansion, yield improvements, export controls, and technology-generation gaps.
