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Explore the latest semiconductor news and technology.
Samsung and Broadcom have signed an MOU covering HBM, sub-2nm manufacturing, and advanced packaging. The figure of over $200 billion is not a confirmed order, and disclosure of breakdowns and mass production conditions is needed for it to become real demand.
Micron has opposed Apple's proposal to source memory chips made in China. A gap exists between near-term price relief and supply improvements expected from 2028 onward, with the Trump administration's additional regulations set to determine adoption conditions.
Intel's Q2 2026 earnings showed 25% revenue growth and a return to operating profit, yet the company posted a net loss of $11.033 billion. The main driver was a $12.529 billion mark-to-market loss on escrow shares, while the narrowing Foundry loss and the fate of 14A external customers also drew attention.
Qualcomm has reportedly notified customers of a double-digit price increase for shipments starting September 1. Product-specific terms have not been disclosed, and whether the increase will be passed on to device prices or lead to spec changes remains unconfirmed.
Etched announced a $300M raise that included participation from SK hynix, and has begun initial production of inference clusters combining low-voltage compute with shared memory. Supply agreements and comparable performance figures have not yet been disclosed.
Reports suggest Intel could handle wafer manufacturing and advanced packaging for NVIDIA's next-generation AI platform Feynman. We examine what's confirmed in official materials versus what remains an unsettled contract scope.
Intel has committed fully to launching mass production of 14A in 2028. The 2028 timing itself isn't new—what's changed is the management decision to invest in PDK development and manufacturing capacity. External customer adoption and yield verification in 2027 are the next gates.
AMD and Cerebras plan to launch a division-of-labor AI inference platform in the second half of 2026, with Helios handling input processing and WSE handling token generation. The claimed up-to-5x figure comes from internal modeling comparing against WSE alone, and disclosure of measured latency and pricing will be the next thing to watch.
AMD has unveiled the HPC-focused EPYC 9006X. It pairs the same up-to-1,152MB L3 seen in Genoa-X with clock speeds up to 5.15GHz and 16-channel memory, with launch reportedly slated for late 2027.
DRAM inflation has surfaced in GM's combined cost increases and in the price of BYD's driver-assistance option. Automakers and suppliers are expanding long-term supply contracts to prepare for shifts in both supply and price.
