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Explore English articles about AI Semiconductor.
SK hynix and collaborators have published a peer-reviewed technical roadmap for co-packaged optics. The plan to extend optical connections eventually to shared memory pools would push AI infrastructure bandwidth design beyond HBM.
An examination of Google and Marvell's TPU-related semiconductor agreement based on SEC filings shows that most of the roughly $12.2 billion stock purchase right is tied to $120 billion in cumulative target revenue—and reveals differing levels of certainty across Broadcom, MediaTek, and AMD.
Micron announced a $10 billion, 10-year research hub in Boise, drawing congratulatory remarks from Jensen Huang and Tim Cook. Around the same time, Western Digital launched an AI research center with Tohoku University. As HBM-first production reallocation drives memory prices higher, we examine the brain-power race unfolding across the US and Japan.
China's semiconductor equipment makers are growing sales, but their reported profit increases of over 400% mix in fair-value gains and swings from losses to profits. This article examines, through their financial results, what it would take to turn the current global equipment shortage into a lasting market share gain.
China is moving forward with limited imports of NVIDIA H200 chips, with roughly 10,000 units each arriving at ByteDance and Tencent. A large gap remains between the 400,000-plus approved units and actual supply, since both US and Chinese approval are required.
Windows 11's Task Manager can now display per-app NPU utilization, execution engine, and memory usage. Standard tools make it easier to pinpoint where AI processing runs and what's driving the load.
A ground-up explainer on HBM (High Bandwidth Memory), the technology shaping AI semiconductor performance. Covers the mechanics of stacking DRAM and connecting it via TSVs, the differences from GDDR, the three-way competition and base die logic shift in the HBM4 generation, the market's rapid expansion toward roughly $60 billion, the resulting DRAM price surge, and the business opportunities for Japanese companies.
Reuters reports that new SF4 orders from Samsung rose 10-15% in the US and China, and 5-10% in Taiwan. While demand from China exceeds supply capacity, prioritization of US customers and capacity reserved for in-house use are constraining the production allocation.
Demand for AI server SSDs and tight supply pushed the combined revenue of the top five NAND makers up 77% in Q2. We unpack how this price-driven growth could reverse when supply increases in 2027.
Roughly $1.3 billion worth of HBM headed to Malaysia. Export statistics alone can't pinpoint Intel's orders, but overlaying Penang's capacity expansion with EMIB-T's commercialization stage reveals signs of movement in AI semiconductor back-end processes.
