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Explore English articles about Data Centers.
TrendForce revised its 2026 AI server shipment forecast upward to approximately 31% growth. Combined capital expenditure from nine major CSPs exceeds $886.7 billion, with demand expanding into power, cooling, and proprietary ASICs.
MediaTek plans to roll out a next-generation SerDes offering roughly 400Gbps per lane in the second half of 2027, aiming to win AI accelerator orders from major US cloud providers. The company is also leveraging advanced packaging technology as it works to grow its data center business into a new pillar of revenue.
Lumentum's CEO warned that surging AI demand could push indium phosphide supply shortages beyond what memory products are experiencing. While expansion at key sites and larger wafer diameters are boosting production, challenges around raw material sourcing and export controls mean the supply-demand crunch is expected to persist through around 2028.
Montage has moved its CXL 3.2-compliant memory expansion chip into trial production, and Samsung and SK hynix have also completed initial validation. Attention now shifts to the mass-production timeline and real-world workload performance.
An analysis of 4,283 U.S. facilities found 97.5% concentrated within metropolitan or micropolitan statistical areas. The strongest association was with local power generation capacity, and former fossil-fuel regions showed a higher share of facilities under development.
With EMIB-T's backlog growing, Intel plans customer volume production in 2027. Whether the material utilization advantage translates into real cost savings depends on the yield of ultra-large packages.
On July 30, 2026, Apple reported Q3 results with revenue of $109.417 billion and EPS of $2.02, both June-quarter records, but the stock fell after-hours on Services and China revenue misses and gross margin pressure from surging memory prices. Cook's final earnings call handed structural challenges to incoming CEO Ternus.
TSMC is reportedly developing an advanced packaging technology resembling Intel's EMIB with Kinsus. The difference from CoWoS-L lies in which layer embeds the silicon bridge and who runs the volume manufacturing process.
Kioxia has shipped samples of a 1Tb TLC using 9th-generation BiCS, and CM10 E3.S/E1.S PCIe 6.0 enterprise SSDs built on 10th-generation BiCS. The dual-axis strategy has moved into actual products.
マイクロソフトの2026年度第4四半期決算は、クラウド事業の売上が予想を上回り、株価が約9％上昇した。巨額の設備投資を継続しつつも、データセンターの稼働効率を高めて迅速に収益化した点が評価されたが、利益には一時的な要因も含まれている。
