Topic
Explore English articles about Memory & Storage.
Nanya Technology has laid out a preliminary plan to invest over NT$200 billion in 2027. The company aims to channel cash generated from surging prices into its new fab, ramping up to a monthly capacity of 30,000 wafers by 2028.
A POSTECH research team announced that it has stably stacked more than 10 layers of 14-micrometer-thick silicon chips using low-temperature, low-pressure bonding. Compared at the same package height as 12-layer HBM, the team confirmed roughly 4x the density, but the demonstration was limited to test chips without DRAM circuitry, and integration into actual HBM or yield data have not yet been presented.
SK hynix listed on NASDAQ on July 10, 2026, raising $26.5 billion in what became the largest IPO ever by a foreign company. Yet its projected PER remains far below the industry median, leaving the question of whether the 'Korea discount' has truly been resolved still unanswered.
SK hynix is set to resume equipment investment at its second NAND fab in Dalian, China. The company aims to bring it online by the first half of 2027, seeking to boost NAND supply capacity ahead of the completion of its new fab in Korea. However, completing the plan hinges on continued approval for equipment imports under U.S. export controls.
In-memory computing, which performs calculations directly within memory, is drawing attention as a way to improve AI power efficiency. A joint US-Korean research team has developed a proprietary memristor SoC with zigzag wiring to eliminate the inefficiency of operations widely used in lightweight AI models, demonstrating extremely high power efficiency that surpasses existing GPUs.
In the DRAM market, legacy products continue to inch up due to uneven supply capacity allocation, while in the NAND market, prices are falling as buyers hold back purchases in the face of high prices—revealing a growing polarization behind the seemingly bullish AI demand narrative. This contrasting movement exposes both supply constraints and the limits of buyers, and going forward, trading volume trends will be key to the market's direction.
Samsung has begun mass production of the PM1763, a PCIe 6.0 enterprise SSD designed to boost data transfer speeds in AI servers. Achieving more than double the read speed of its predecessor, the drive aims to eliminate bottlenecks and enable efficient operation on next-generation AI platforms. (119 characters)
XBM, Intel's proposed new memory concept, is less about replacing HBM4 outright and more about optimizing on-package memory connections using UCIe. The aim is to reduce implementation footprint and boost bandwidth density by leveraging high-speed serial links and placing DRAM within wiring layers.
Facing surging memory prices, PC makers such as Lenovo and ASUS are expanding certification and adoption of products from China-based suppliers. The strategy aims to reduce dependence on existing major suppliers such as Korean makers, broaden procurement options, and strengthen price-negotiation leverage amid rising component costs.
As the overall notebook PC market contracts, Apple is sidestepping the impact of rising DRAM costs thanks to its unified memory architecture, and is projected to grow 21.7% in 2026—overtaking Dell to claim the world's No. 3 spot. Windows machines, by contrast, are passing soaring DRAM prices on to consumers, eroding their competitiveness in the market.
