Topic
Explore English articles about Memory & Storage.
In disputes over US memory patents, Kioxia was ordered to pay massive damages for infringing a Viasat patent, while Samsung and others face an import ban petition from Netlist. Not the memory cells themselves, but peripheral technologies like error correction and stacking control are having a major impact on product distribution.
Administrative records confirm that a memory factory operated by China's SwaySure is running, but the monthly capacity figures that have circulated for some time are not new information. While the US has added the company to its export control list—suggesting a close relationship with Huawei—significant technical barriers to HBM mass production remain.
Apple's procurement of China-made memory is not immediately banned outright. Meanwhile, U.S. federal procurement regulations naming CXMT and YMTC take effect at the end of 2027, forcing supplier verification for federally supplied devices.
A 48GB CXMT DDR5 kit hit 8600 MT/s in an ASUS test environment. We examine the real-time timing conversions and batch-to-batch variance to understand what conditions must be verified in mass-production units.
CXMT's DRAM wafer input capacity is projected to approach over 90% of Micron's by the end of 2026. However, gaps remain in bit shipment volume, manufacturing cost, and HBM mass-production capability, meaning the same monthly wafer count doesn't translate to equal supply value.
In chiral antiferromagnets, promising as next-generation memory materials, thinning the film thickness to 30 nanometers or less and optimizing heat dissipation has enabled ultrafast spin-reversal control that does not rely on heat. This opens a path to overcoming the speed limitations imposed by conventional thermal relaxation.
Samsung has launched an experienced-hire recruitment drive spanning HBM design, packaging, and customer qualification. With an eye on scaling up HBM4 production and developing next-generation products, the company aims to strengthen coordination across processes to shorten development timelines and improve mass-production yields, boosting its competitiveness in the AI memory market.
The memory semiconductor market keeps posting record earnings on the AI boom, yet Samsung's stock fell instead. With more than three years needed from groundbreaking to mass production at new fabs, and SK hynix targeting full-scale capacity expansion only by 2034, this piece examines the supply lag and compares the current surge quantitatively against the two previous boom-and-bust cycles.
SK hynix's CEO has forecast the worst memory supply shortage in history for 2027. While AI demand spreads beyond HBM into DRAM and NAND, the expanded production facilities in Yongin and Cheongju will only come online gradually between 2027 and 2029.
A research group at the University of Tokyo has developed, for the first time in the world, a technology that reads and writes the magnetic information of a single atom using only quantum mechanical "force," without using any electric current whatsoever. Because this method can prevent heat generation from Joule heating as well as malfunctions, it represents a groundbreaking achievement toward realizing the ultimate high-density memory.
