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SAXON Q has begun taking orders for room-temperature 128- and 512-qubit machines. The new systems use a multi-core architecture with 8 or 16 qubits per core, with actual delivery and third-party verification standing as the next hurdles.
Intel and Fortinet will jointly develop and manufacture the next-generation security ASIC "SP6" on Intel 4. It marks the first publicly disclosed external design win for Intel 4, as Fortinet expands its design and supply infrastructure.
TrendForce forecasts that the NAND supply shortage will ease in the second half of 2027. Higher-density conversions on existing lines, increased production by Chinese manufacturers, and falling demand from smartphones and notebook PCs will support the supply-demand reversal.
Z.ai reportedly completed and partially activated a 1GW-class data center built entirely with domestic AI chips. We examine the possible shift from its IPO-era cloud-procurement policy and the conditions needed to gauge real-world performance.
NVIDIA has released a detailed white paper on the Vera CPU along with SPECrate 2026 integer estimates. With fewer cores, it outperforms EPYC 9755 by about 3%, though official registration and independent verification remain pending.
China has commercialized a 7nm SoC without EUV, but DUV multi-patterning adds process steps and alignment work as geometries shrink. Based on ZEISS's remarks, this article examines mass-production viability and Huawei's alternative approach.
NVIDIA revealed DLSS 5's three models and per-object masking, showing a design that lets developers decide scene-by-scene how far generative AI's influence extends. GPU requirements and measured latency remain unclear ahead of its fall release.
Rubin cuts wait times across MoE weight transfers, long-context Attention, kernel dependencies, and NVLink synchronization. NVIDIA has fleshed out a design that keeps inference compute units busy and boosts throughput per watt.
Google has expanded its Gemini Flash lineup with three models, with 3.6 Flash cutting both output pricing and token generation simultaneously. Meanwhile, the flagship 3.5 Pro, originally slated for June availability, remains in partner testing.
In Shenzhen's Huaqiangbei district, used 16GB DDR4 has fallen more than 30% from its peak, while new modules and DRAM contract prices continue to rise. This piece untangles the coexistence of localized price drops and a still-tight global supply situation.
