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Explore the latest semiconductor news and technology.
TSMC's Q2 2026 earnings showed net profit surging 77.4% year-over-year, driven by expanding AI-related demand and cost improvements. Backed by strong demand forecasts, the company raised its capital expenditure guidance to as much as $64 billion and is advancing additional investment in Arizona.
Taiwan's Formosa Plastics will raise prices for electronic-grade hydrofluoric acid and other chemicals in Q3 2026, driven by growing demand from advanced semiconductor production increases and soaring raw material costs. While the company is also expanding supply capacity, the new capacity won't come online until 2027, raising concerns about continued supply-demand tightness in the near term.
CXMT's DRAM wafer input capacity is projected to approach over 90% of Micron's by the end of 2026. However, gaps remain in bit shipment volume, manufacturing cost, and HBM mass-production capability, meaning the same monthly wafer count doesn't translate to equal supply value.
Intel has shipped some Panther Lake units manufactured using High-NA EUV to customers for the first time. This is not a wholesale switch across all of 18A, but rather a mass-production demonstration in which specific layers were dual-qualified alongside conventional EUV.
China's IC export value surged approximately 96% year-on-year in the first half of 2026, but export volume growth was limited to just 6.9%. This divergence is primarily driven by the global surge in memory prices, and caution is needed before interpreting the export value spike as a major improvement in China's production capacity or technological level.
Bosch has begun sample production of silicon carbide semiconductors using 200mm wafers at its US plant, aiming for commercial production sometime in 2026. Backed by substantial public support, the facility is set to become one of the largest of its kind in the US, but amid a slowdown in the EV market and rising competition, success will hinge on yield improvements and capacity utilization.
KeyBanc projects that Intel will manufacture 80-90% of Nova Lake tiles in-house on 18A. We examine the 18A improvements confirmed in official disclosures and the conditions under which reduced TSMC reliance would affect gross margin and supply capacity.
US-based TYLsemi has unveiled a chiplet and volume-production support model that standardizes the surrounding functions of AI chip development. By providing reusable dies that handle I/O and power delivery, the company says customers can focus solely on their proprietary compute circuit designs, enabling significant reductions in development time and cost.
Shanghai-based Dongfang Suanxin has unveiled the DF1000, an AI chip that combines a 14nm process with 3D stacking technology against the backdrop of US export controls. Its design vertically stacks logic circuits and DRAM to achieve high memory bandwidth, but mass-production yield and building a practical software ecosystem remain challenges ahead.
The memory semiconductor market keeps posting record earnings on the AI boom, yet Samsung's stock fell instead. With more than three years needed from groundbreaking to mass production at new fabs, and SK hynix targeting full-scale capacity expansion only by 2034, this piece examines the supply lag and compares the current surge quantitatively against the two previous boom-and-bust cycles.
