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Explore English articles about AI Semiconductor.
DeepSeek V4.1 Flash splits compute between input and output and slims down the storage of long conversation histories. We look at the benchmark conditions and official pricing to see where the savings matter for running AI agents.
Japan Display's closed Mobara plant is drawing competing bids from U.S. memory giant Micron and major Korean semiconductor substrate makers. Talks are advancing at roughly 500 billion won (about ¥55 billion), with the site's Gen 6 building and power infrastructure eyed for conversion to advanced packaging and data center use.
OpenAI says its next-generation chip work with Samsung is advancing. Splitting HBM's internal logic manufacturing from contract production of the compute chip itself, we read the public record to see where the two firms connect and what remains undisclosed.
Reports put CXMT's 8-layer HBM3 yield at about 25%, but the process-level figures and their denominators need checking. Here is what leading makers' experience and testing steps reveal about stable domestic HBM supply.
A comparison of the A20 Pro and A19 Pro explains what Apple's announced gains mean in practice. We look at the memory bandwidth and cooling changes, plus how Snapdragon and Dimensity feed data to their processors, to see where real-world differences may appear.
SMIC's Q2 2026 revenue rose 20% to over $3 billion. We break down the 14.4% rise in shipments and shifts in product mix, examining SMIC's approach to Samsung and its distance from leading-edge technology using primary sources.
France's Mistral AI has raised a record €3 billion for Europe, led by Samsung Electronics. The two companies will jointly develop dedicated models for defect detection and yield stabilization, running in air-gapped, on-premise environments inside semiconductor fabs that require strict confidentiality, advancing the practical rollout of sovereign AI.
Arm has unveiled CSS for Mobile 2, its next-generation smartphone compute platform. With a C2 CPU cluster featuring double the SME2 units and a GPU with a dedicated integrated AI accelerator, it aims to deliver both agentic AI and desktop-class graphics within a 1W power envelope.
Huawei's two-layer stacked Kirin 2026 reportedly delivers major power savings at equivalent performance. But at peak performance, power density exceeds the previous generation, and absolute junction temperature figures remain unpublished.
DRAM industry revenue rose 59.5% in Q2 2026, but bit shipments increased only modestly. Here's why slowing price growth in Q3 shouldn't be read as a sign that supply is catching up, based on company-by-company market share and long-term contracts.
