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Explore English articles about AI Semiconductor.
Qualcomm has unveiled its next-generation mobile GPU architecture. By embedding dedicated AI cores and an 18MB high-speed cache across three GPU slices, the company keeps heavy rendering workloads entirely on-chip, targeting up to 40% better power efficiency.
TSMC is targeting 4,100W-class CoWoS packages and has already demonstrated uniform heat dissipation beyond 5kW in test vehicles. Here's what sealing, warpage, and rack integration reveal about the path to mass production of direct-to-silicon liquid cooling.
Cross-referencing Anthropic's $35 billion compute deal with Hut 8's disclosed 704MW facility, this piece breaks down the financing structure and division of responsibility among the four companies involved—including NVIDIA's unusual role as a data center tenant.
Samsung aims for 2x performance and a 20% cut in thermal resistance with HBM5. Meanwhile, zHBM's claimed "8x" improvement is reported against different baselines—HBM4E in some accounts, HBM5 in others—making disclosure of absolute bandwidth and test conditions the key to evaluating the roadmap.
The spot price of 36GB HBM3E has reportedly reached about $2,100 per unit, four to five times the long-term contract price. Samsung plans to allocate 60-70% of its memory production capacity to long-term contracts running through 2031, and whether a buyer is inside or outside those contracts is starting to determine the terms under which AI memory can be procured.
NVIDIA's $3.5 billion purchase of MediaTek convertible bonds is examined as a strategy linking MediaTek's advanced packaging capabilities with NVLink infrastructure, including how the funds will be used, the non-exclusive nature of the deal, and mass-production constraints.
We break down TSMC's projected "50x" leap by 2029 into the roles played by CoWoS, SoIC, and optical interconnects, examining where effective performance ends and mass-production conditions begin. We also clarify the difference between the 50% silicon photonics market forecast and actual CPO adoption rates.
Intel expects revenue from EMIB-T-based advanced packaging to grow starting late 2027 and scale up by 2029. Customer qualification, yield, and financial disclosure will determine whether the technology becomes a real external business.
MediaTek is expanding its advanced packaging hiring. Job postings and technical documents reveal a plan to unify AI ASIC design, mass production, and procurement under one roof.
Chinese DRAM giant CXMT is reportedly producing small quantities of HBM3E, with Alibaba's T-Head and Cambricon testing it for adoption. Before any 2027 deployment, customer qualification, yield, and supply volume still need to be confirmed.
