68 results for “semiconductor”
NVIDIA has agreed to acquire Hugging Face, a cornerstone of the open AI ecosystem, for $12.9303 billion. The deal extends the chipmaker's reach beyond semiconductor supply into the upstream distribution of AI models, positioning it to champion open, neutral infrastructure as rivals push custom ASICs.
Rapidus, a company with no mass-production track record, is attempting to reach the 2-nanometer chip generation by combining technology transfers from IBM and imec, a production method called RUMS, and roughly ¥2.9 trillion in government support — explained alongside the 36-year decline of Japan's semiconductor industry since 1988.
NTT, Japan's telecom giant, is pushing optical wiring deeper into semiconductor packages. Here's why the smallest connections—between dies—take until 2032, even as board-to-board links go commercial far sooner, and what that gap reveals about chip manufacturing precision.
The US administration is considering an expansion of semiconductor tariffs that could raise investment costs for AI infrastructure if the data center exemption is narrowed. The real impact hinges on duty-free quotas, how servers are treated, and safeguards against double taxation.
A University of Tokyo research group has used adjacent atomic columns in a silicon crystal—spaced 136 pm apart—as a natural double slit, publishing in Nature an interferometric measurement that shrinks Young's experiment by a factor of 10 million. By reading the visibility of the interference fringes, the method quantifies the stiffness of atomic bonds and their correlated thermal vibrations, potentially offering atomic-level insight for heat-dissipation design in semiconductors.
As AI chip TDPs exceed 1 kW and liquid-cooling adoption jumps from 6% to 53% in three years, thermal management has replaced raw performance as the top constraint in semiconductor design. From imec's STCO research to Samsung's zHBM concept and KAIST's AI design agents, here's a look at the front lines of the battle against heat.
LG Electronics PRI has reportedly received its first order for a semiconductor packaging LDI tool from an unnamed OSAT. Confirming mass-production adoption still requires details on throughput, overlay accuracy, and yield after delivery.
An examination of Google and Marvell's TPU-related semiconductor agreement based on SEC filings shows that most of the roughly $12.2 billion stock purchase right is tied to $120 billion in cumulative target revenue—and reveals differing levels of certainty across Broadcom, MediaTek, and AMD.
China's semiconductor equipment makers are growing sales, but their reported profit increases of over 400% mix in fair-value gains and swings from losses to profits. This article examines, through their financial results, what it would take to turn the current global equipment shortage into a lasting market share gain.
A ground-up explainer on HBM (High Bandwidth Memory), the technology shaping AI semiconductor performance. Covers the mechanics of stacking DRAM and connecting it via TSVs, the differences from GDDR, the three-way competition and base die logic shift in the HBM4 generation, the market's rapid expansion toward roughly $60 billion, the resulting DRAM price surge, and the business opportunities for Japanese companies.
