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Explore the latest semiconductor news and technology.
Nanya Technology has set an upper limit of NT$346.6 billion for capital expenditure on the new Fab 5A and raised its 2026 budget. Centered on a 30,000 wafers/month ramp-up in 2028 and EUV development, the company is proceeding with phased DRAM capacity expansion.
Anthropic has publicly confirmed for the first time that it is building an in-house silicon team for Claude. Job postings point to design support including RTL generation and formal verification, but the use case and mass production timeline remain unannounced, and the existing multi-chip strategy continues.
Chinese DRAM maker CXMT refused Apple's request for a price cut, instead quoting prices on par with or above Samsung's. AI-driven supply shortages and the lock-in of domestic Chinese customers are overturning a 30-year-old memory procurement structure that had long favored buyers.
NEO Semiconductor has announced "NEO.AI," which simultaneously addresses the constraints of on-chip SRAM and HBM capacity within GPUs. The next hurdle toward mass production will be demonstrating X-SRAM in silicon and scaling 3D X-DRAM to more layers.
Qualcomm's chip price increase for September shipments is reportedly being negotiated with targets of 10-15% for flagships, 5-7% for mainstream, and 0-2% for low-end. The impact on device prices will vary depending on memory costs and contract terms.
zHBM, unveiled by Samsung at FMS 2026, is a new concept that physically shortens data travel distance by moving HBM from beside the processor to above it. Using HBM5's projected bandwidth of roughly 4 TB/s as the baseline, Samsung claims an 8x improvement—but since HBM5's own specification is not yet finalized, verification of these figures will have to wait for mass production.
In the high-entropy oxide A6WO4, which mixes six transition metals, researchers confirmed a maximum thermal conductivity of 0.7 W/mK alongside semiconductor-like electrical transport. Challenges remain in reproducing the thermoelectric performance and scattering mechanisms of the current composition.
AMD's Q2 2026 revenue reached a record $11.536 billion. Data Center accounted for 58% of the total, while Gaming fell 31% year-over-year, making the shift in revenue drivers unmistakable.
Kioxia and Sandisk achieved an areal density of 37 Gb/mm² with 332-layer QLC 3D NAND flash, overtaking Samsung's V10 (28 Gb/mm²), which leads in layer count, in terms of density. Through the CBA architecture, Toggle DDR6.0, and PI-LTT technology, they simultaneously improved density, speed, and power efficiency, delivering a design that meets the large-capacity storage demands of AI data centers.
Lexar has listed a 32GB DDR5-7200 kit using domestic Chinese DRAM for 3,999 yuan on JD.com. While clock speeds have advanced, the emergence of a new supplier doesn't necessarily translate into cheaper memory.
