
TSMC's 5.5x CoWoS Hits 98%+ Yield, Shifting Constraints to Memory and ABF
TSMC has achieved stable yields exceeding 98% on 5.5x reticle-size CoWoS packaging technology for large AI chips. However, the supply challenge is shifting from within the process itself to external factors such as HBM and substrate shortages, material variability, and ensuring system-level reliability.








