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Explore English articles about AI Semiconductor.
CXMT's DRAM wafer input capacity is projected to approach over 90% of Micron's by the end of 2026. However, gaps remain in bit shipment volume, manufacturing cost, and HBM mass-production capability, meaning the same monthly wafer count doesn't translate to equal supply value.
China's IC export value surged approximately 96% year-on-year in the first half of 2026, but export volume growth was limited to just 6.9%. This divergence is primarily driven by the global surge in memory prices, and caution is needed before interpreting the export value spike as a major improvement in China's production capacity or technological level.
Customers worried about tight supply and rising prices for memory and other components amid AI demand redirected their capital spending toward servers and storage, delaying IBM's mainframe-related deal closures. This caused revenue to fall short of market expectations, sending the company's stock down by its worst-ever margin.
Shanghai-based Dongfang Suanxin has unveiled the DF1000, an AI chip that combines a 14nm process with 3D stacking technology against the backdrop of US export controls. Its design vertically stacks logic circuits and DRAM to achieve high memory bandwidth, but mass-production yield and building a practical software ecosystem remain challenges ahead.
Samsung has launched an experienced-hire recruitment drive spanning HBM design, packaging, and customer qualification. With an eye on scaling up HBM4 production and developing next-generation products, the company aims to strengthen coordination across processes to shorten development timelines and improve mass-production yields, boosting its competitiveness in the AI memory market.
The memory semiconductor market keeps posting record earnings on the AI boom, yet Samsung's stock fell instead. With more than three years needed from groundbreaking to mass production at new fabs, and SK hynix targeting full-scale capacity expansion only by 2034, this piece examines the supply lag and compares the current surge quantitatively against the two previous boom-and-bust cycles.
Reports have surfaced that the Pixel 11's Tensor G6 will use TSMC's 2nm process. Drawing on clues about a 7-core CPU and a MediaTek-based modem, we examine how power might be allocated across the SoC as a whole.
Intel's space-oriented SoC "Starfire" targets up to 75 TOPS using 18A and Foveros, but radiation tolerance figures and spaceflight qualification remain undetermined. Judging its real capability will have to wait for Q3 2026 samples and test results.
SK hynix's CEO has forecast the worst memory supply shortage in history for 2027. While AI demand spreads beyond HBM into DRAM and NAND, the expanded production facilities in Yongin and Cheongju will only come online gradually between 2027 and 2029.
As demand for advanced packaging technology for AI semiconductors surges, TSMC is expanding outsourcing to and cooperation with external companies to resolve its supply shortage. This situation is creating business opportunities for Intel's competing technology and for the proprietary packaging methods of Taiwan's OSAT companies, reshaping the balance of power in the supply chain.
