テクノロジー
TSMC、3D積層SoICパッケージテクノロジーの進化により数年以内に1.6nmと2nmダイを積層させることも可能に
TSMCは現在全世界でテクノロジーシンポジウムを開催中だ（6月28日には日本でも開催される）。2nmや1nm世代と言った、最先端プロセスが注目されがちではあるが、同社はInFO、CoWoS、TSMC-SoIC等の先進パッ […]
Term
SoIC-P
Overview
最終更新: 2026年7月9日SoIC-P is a version of TSMC's System on Integrated Chips technology that uses micro-bumps (µbumps) rather than bumpless hybrid bonding. It is designed for more cost-sensitive and lower-performance applications compared to SoIC-X.
Mentioned Articles
1 件External Mentions
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