テクノロジー
TSMC、3D積層SoICパッケージテクノロジーの進化により数年以内に1.6nmと2nmダイを積層させることも可能に
TSMCは現在全世界でテクノロジーシンポジウムを開催中だ（6月28日には日本でも開催される）。2nmや1nm世代と言った、最先端プロセスが注目されがちではあるが、同社はInFO、CoWoS、TSMC-SoIC等の先進パッ […]
Term
SoIC-X
Overview
最終更新: 2026年7月9日SoIC-X is the bumpless variant of TSMC's System on Integrated Chips technology. It utilizes copper-to-copper hybrid bonding to achieve extremely high interconnect density and low latency, primarily targeted at high-performance computing (HPC) applications.
Mentioned Articles
1 件External Mentions
6 件- arXivBoundary-conformal integration for the invariant-imbedding T-matrix method: high-order convergence for faceted particles
- arXivThermal X-rays breaking out from pre-explosion ejecta of a dying massive star
- arXivObservational Implications of Cosmic Ray-Inverse Compton 'Boosted' Cool Cores in Clusters
- arXivCompton hump reverberation lag in the bright Seyfert 1 galaxy IC 4329A with NuSTAR
- arXivX-ray view of a massive node of the Cosmic Web at z=3 II. Discovery of extended X-ray emission around a hyperluminous QSO
- arXivCosmic Rays Masquerading as Cool Cores: An Inverse-Compton Origin for Cool Core Cluster Emission