Topic
Explore English articles about Semiconductor Manufacturing.
NTHU has ordered a second-generation multi-column electron beam lithography system, the MBX. Shipment is scheduled for 2027, and through joint development with Taiwanese companies, the system will bring maskless direct-write lithography into advanced packaging processes.
IBM has signed a definitive agreement to acquire HRL, jointly owned by Boeing and GM. The deal brings in spin qubits and cryogenic control, expanding manufacturing capabilities beyond the superconducting approach.
Micron has opposed Apple's proposal to source memory chips made in China. A gap exists between near-term price relief and supply improvements expected from 2028 onward, with the Trump administration's additional regulations set to determine adoption conditions.
Intel's Q2 2026 earnings showed 25% revenue growth and a return to operating profit, yet the company posted a net loss of $11.033 billion. The main driver was a $12.529 billion mark-to-market loss on escrow shares, while the narrowing Foundry loss and the fate of 14A external customers also drew attention.
Qualcomm has reportedly notified customers of a double-digit price increase for shipments starting September 1. Product-specific terms have not been disclosed, and whether the increase will be passed on to device prices or lead to spec changes remains unconfirmed.
AMD and Cerebras plan to launch a division-of-labor AI inference platform in the second half of 2026, with Helios handling input processing and WSE handling token generation. The claimed up-to-5x figure comes from internal modeling comparing against WSE alone, and disclosure of measured latency and pricing will be the next thing to watch.
Micro-transfer printing technology, which fabricates light-emitting and modulator materials incompatible with silicon separately before transferring them, is drawing attention. It leverages the advantages of CMOS processes while enabling high-precision integration of high-performance lasers and modulators on the same chip, positioning it as a promising foundation for next-generation high-speed communications.
Nanya Technology forecasts the 2026 memory market will exceed $800 billion. Based on WSTS outlook and the company's earnings, we track how AI inference demand, price increases, and 2028 new fab plans will move the market.
On July 17, 2026, Rapidus announced an AI-agent design collaboration with Cadence, targeting up to 2x TAT improvement. Cadence had struck a similar partnership with Intel Foundry around the same time, revealing a battle for control over the design infrastructure underpinning leading-edge nodes.
Acoustic chips have enabled miniaturization by converting radio waves into sound, but they faced a fundamental limit: applying high power caused vibrations that severed the wiring. The Hong Kong University of Science and Technology has overturned a half-century-old assumption by sealing the surface with a special layer to disperse stress, achieving 12 times the power tolerance of conventional designs and opening the door to direct satellite communication from smartphones.
